volume | PIER Journals

Abstract

A new structure design of a multi-band suspended stepped slot microstrip patch antenna with copper ground plane for future mobile communications is proposed and presented. A parametric study for the effect on the proposed antenna is done on a par with the integration of a polycrystalline silicon solar cell. The compact low profile proposed antenna is developed using Printed Circuit Board (PCB) technology on a substrate, FR4 with physical size of 50×50 mm². Simulated and measured results are presented to validate the usefulness of the proposed antenna structure for Wi-Max and future mobile communications. The measured result reveals that the presented stepped slot patch antenna with copper ground plane offers impedance bandwidth of 3.94% (covering 5.46 GHz-5.68 GHz band), 3.06% (covering 7.08 GHz-7.3 GHz band), and 9.26% (covering 8.34 GHz-9.15 GHz band). The same radiating patch with solar ground plane offers impedance bandwidth of 4.58% (covering 5.12 GHz-5.36 GHz band) and 3.06% (covering 7.32 GHz-8.02 GHz band) for future mobile communications. Good VSWR and radiation pattern characteristics are obtained in the frequency band of interest.

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Mr. Suresh Babu Thandullu Naganathan

Prof. Dhandapani Sivakumar