volume | PIER Journals

2010-09-16

Electromagnetic Simulation and Characterization a Metal Ceramic Package for Packaging of High Isolation Switches

Sandeep Chaturvedi,

Dr. Sandeep Chaturvedi

ATQC

Gallium Arsenide Enabling Technology Centre

India

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Sangam V. Bhalke,

Dr. Sangam V. Bhalke

Gallium Arsenide Enabling Technology Centre

India

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G. Sai Saravanan,

Dr. G. Sai Saravanan

Gallium Arsenide Enabling Technology Centre

India

Homepage

Shiban Kishen Koul

Dr. Shiban Kishen Koul

Indian Institute of Technology Delhi

India

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Progress In Electromagnetics Research C, Vol. 16, 111-125, 2010

doi:10.2528/PIERC10061406

Abstract

Packaging of planar MMICs poses a unique challenge at microwave frequencies as the dimensions of the encapsulating cavity are comparable to wavelength at the operational frequencies. In addition, the effect of ground loops (caused by bond wires exposed to ground over extended length due to gaps between interconnects) deteriorates the situation even further in circuits like MMIC switches requiring high isolation between ports. The ground loops cause reflections thereby deteriorating the insertion loss figure of merit. This paper presents optimization of design of a metal ceramic package used for packaging an SPDT MMIC switch working in the frequency range of 5-6 GHz. The microwave performance of the package was simulated using EM simulation with parameters including cavity dimensions, port placement, gaps between interconnect lines, package feed-thrus and MMIC chip pads. Detailed characterization of the bare package and packaged SPDT MMIC done later shows a good match between the simulated and measured performance. The SPDT MMIC performance degradation was arrested by improvement in the package structure and it showed insertion loss of -1.6dB and input/output (I/O) return losses of ~16dB in the new package as compared to the values of -2.1dB insertion loss and -12dB I/O return losses in the original package. The port-to-port isolation remained unchanged (~40 dB in both cases) as it is governed by the MMIC assembly inside the package rather than the conditions at the I/O interfaces in this kind of large sized packages.

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Sandeep Chaturvedi, Sangam V. Bhalke, G. Sai Saravanan, and Shiban Kishen Koul, "Electromagnetic Simulation and Characterization a Metal Ceramic Package for Packaging of High Isolation Switches," Progress In Electromagnetics Research C, Vol. 16, 111-125, 2010.
doi:10.2528/PIERC10061406

References

1. Uda, H., T. Hirai, H. Tominaga, K. Nogawa, T. Sawai, S. Higashino, and Y. Harada, "A very high isolation GaAs SPDT switch IC sealed in an ultra compact plastic package," 17th Annual IEEE Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1995. Technical Digest, 132-135, Oct. 29--Nov. 1, 1995.

2. Uda, H., T. Hirai, H. Tominaga, K. Nogawa, T. Sawai, T. Higashino, and Y. Harada, "Development of ultra-compact plastic-packaged high-isolation GaAs SPDT switch," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, Vol. 19, No. 1, 182-187, Feb. 1996.

3. Xiao, Q., G. Samiotes, T. Galluccio, and B. Rizzi, "A high performance DC-20 GHz SPDT switch in a low cost plastic QFN package," European Microwave Integrated Circuits Conference, 2009. EuMIC 2009, 320-323, Sep. 28--29, 2009.

4. Jessie, D. and L. E. Larson, "An X-band small outline leaded plastic package for MMIC applications," IEEE Transactions on Advanced Packaging, Vol. 25, No. 3, 439-447, Aug. 2002.

5. Ishitsuka, F. and N. Sato, "Low-cost, high-performance package for a multi-chip MMIC module," 10th Annual IEEE Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1988. Technical Digest 1988, 221-224, Nov. 6--9, 1988.

6. Decker, D. R., H. M. Olson, R. Tatikola, R. Gutierrez, and N. R. Mysoor, "Multichip MMIC package for X and Ka bands," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, Vol. 20, No. 1, 27-33, Feb. 1997.

7. Liang, T., J. A. Pla, P. H. Aaen, and M. Mahalingam, "Equivalent-circuit modeling and verification of metal-ceramic packages for RF and microwave power transistors," IEEE Transactions on Microwave Theory and Techniques, Vol. 47, No. 6, 709-714, Jun. 1999.

8. Jackson, R. W., "An electromagnetic model for determining resonance frequencies of low cost MMIC packages," IEEE Transactions on Microwave Theory and Techniques, 1816-1819, Sep. 1994.

9. Olson, H. M., "A compact model for predicting the isolation of ports in a closed rectangular microchip package," IEEE Transactions on Microwave Theory and Techniques, 81-86, Jan. 1996.

10. Ndagijimana, F., J. Engdahl, A. Ahmadouche, and J. Chilo, "The inductive connection effects of a mounted SPDT in a plastic SO8 package," IEEE MTT-S Digest, 91-94, 1993.

11. Cascade SUMMIT 10600 Thermal Probe Station, Cascade MicroTech, USA, www.cmicro.com.

12. CST Microwave Studio, version 5.0, 3D elecromagnetic simulation software, Computer Simulation Technology, GMBH.

13. Sai Saravanan, G., S. Chaturvedi, M. K. Bhat, and S. Bhalke, Optimization of SPDT package design for C-Band T/R Module, Internal Report # SSPL-188-TR-2005, Solid State Physics Laboratory, New Delhi, Dec. 2005.