volume | PIER Journals

Abstract

The paper presents the design of a novel ultra-wideband microwave crossover for the use in microstrip circuits. The proposed structure includes a double microstrip-coplanar waveguide (CPW) vertical interconnect in single-layer substrate technology which allows an inclusion of a finite-width coplanar waveguide (CPW) on the top side of the substrate to achieve the required cross-link. The presented design is verified using the full-wave electromagnetic simulator Ansoft HFSS v.13 and experimental tests. The obtained experimental results show that in the frequency band of 3.2-11 GHz, the crossover has an isolation of 20 dB accompanied by insertion losses of no more than 1.5 dB.

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Dr. Yifan Wang

Dr. Amin M. Abbosh

Dr. Bassem Henin