Vol. 115

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2021-08-19

A 28 GHz Surface-Mount Endfire Antenna Based on Ball Grid Array Packaging for 5G New Radio

By Xiubo Liu, Wei Zhang, Dongning Hao, and Yanyan Liu
Progress In Electromagnetics Research C, Vol. 115, 41-50, 2021
doi:10.2528/PIERC21070503

Abstract

In this article, a 28 GHz endfire antenna based on ball grid array (BGA) packaging is proposed for the 5G mmWave new radio (NR). The antenna is composed of a pair of dipole patches fed by a substrate integrated waveguide (SIW). Besides, quasi-coaxial vertical transition and transition from grounded coplanar waveguide (GCPW) to SIW are designed on the substrate to achieve compact size. The substrate is based on a single-layer printed circuit board (PCB), which can meet the cost-effectiveness requirements of the 5G application. Meanwhile, the proposed antenna can be easily integrated with other surface-mount devices by using the BGA packaging. In particular, it can be mounted near the RF front-end chipset to improve system performance. Finally, the prototype is manufactured and verified. Experimental results show that the -10 dB bandwidth of the proposed antenna is 5.35% in the range of 27.3 to 28.8 GHz, and the peak gain achieves 4.4 dBi at 29 GHz.

Citation


Xiubo Liu, Wei Zhang, Dongning Hao, and Yanyan Liu, "A 28 GHz Surface-Mount Endfire Antenna Based on Ball Grid Array Packaging for 5G New Radio," Progress In Electromagnetics Research C, Vol. 115, 41-50, 2021.
doi:10.2528/PIERC21070503
http://jpier.org/PIERC/pier.php?paper=21070503

References