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2008-01-08
Characterization of the Susceptibility of Integrated Circuits with Induction Caused by High Power Microwaves
By
Progress In Electromagnetics Research, Vol. 81, 61-72, 2008
Abstract
This paper examines malfunction and destruction of semiconductors by high power microwaves. The experiments employ a waveguide and a magnetron to study the influence of high power microwaves on TTL/CMOS IC inverters. The TTL/CMOS IC inverters are composed of a LED circuit for visual discernment. A CMOS IC inverter damaged by a high power microwave is observed with power supply current and delay time. When the power supply current was increased 2.14times for normal current at 10 kV/m, the CMOS inverter was broken by latch-up. The CMOS inverter damaged by latch-up returned its original level of functioning, because parasitic impedance inside the chip increased with the elapse of time. Three different types of damage were observed by microscopic analysis: component, onchipwire, and bondwire destruction. Based on the results, TTL/CMOS IC inverters can be applied to database to elucidate the effects of microwaves on electronic equipment.
Citation
Sun-Mook Hwang, Joo-Il Hong, and Chang-Su Huh, "Characterization of the Susceptibility of Integrated Circuits with Induction Caused by High Power Microwaves," Progress In Electromagnetics Research, Vol. 81, 61-72, 2008.
doi:10.2528/PIER07121704
References

1. Giri, D. V. and F. M. Tesche, "Classification of intentional electromagnetic environments (IEME)," IEEE Transaction on Electromagnetic Compatibility, Vol. 46, No. 3, 322-328, 2004.
doi:10.1109/TEMC.2004.831819

2. Chen, C. H., C. L. Liu, C. C. Chiu, and T. M. Hu, "Ultrawide band channel calculation by SBR/image techniques for indoor communication," Journal of Elelctromagnetics Wave and Applications, Vol. 20, No. 1, 41-51, 2006.
doi:10.1163/156939306775777387

3. Zhang, M. T., Y. B. Chen, Y. C. Jiao, and F. S. Zhang, "Dual circularly polarized antenna of compact structure for RFID application," Journal of Elelctromagnetics Wave and Applications, Vol. 20, No. 14, 1895-1902, 2006.
doi:10.1163/156939306779322611

4. Albagory, Y., "A novel design of arbitrary shaped cells for efficient coverage from high altitude platforms," Progress In Electromagnetics Research Letters, Vol. 1, 245-254, 2008.
doi:10.2528/PIERL07120505

5. Mohammadi, F. A. and M. C. E. Yagoub, "Electromagnetic model for microwave components of integrated circuits," Progress In Electromagnetics Research B, Vol. 1, 81-94, 2008.
doi:10.2528/PIERB07101802

6. Tu, T. C. and C. C. Chiu, "path loss reduction in an urban area by genetic algorithms," Journal of Elelctromagnetics Wave and Applications, Vol. 20, No. 3, 319-330, 2006.
doi:10.1163/156939306775701696

7. Soliman, M. S., T. Morimoto, and Z. I. Kawasaki, "Threedimensional localization system for impulsive noise sources using ultra-wideband digital interferometer technique," Journal of Elelctromagnetics Wave and Applications, Vol. 20, No. 4, 515-530, 2006.
doi:10.1163/156939306776117027

8. Golestani-Rad, L. and J. Rashed-Mohassel, "Rigorous analysis of EM-wave penetration into a typical room using FDTD method: The transfer function concept," Journal of Elelctromagnetics Wave and Applications, Vol. 20, No. 7, 913-926, 2006.
doi:10.1163/156939306776149851

9. Bäckström, M. G. and LovstrandK. G., "Susceptibility of electronic systems to high-power microwaves: Summary of test experience," IEEE Transaction on Electromagnetic Compatibility, Vol. 46, No. 3, 396-403, 2004.
doi:10.1109/TEMC.2004.831814

10. Radaky, W. A. and C. E. Baum, "Introduction to the special issue on high-power electromagnetics (HPEM) and intentional electromagnetic interference (IEMI)," IEEE Transaction on Electromagnetic Compatibility, Vol. 46, No. 3, 314-321, 2004.
doi:10.1109/TEMC.2004.831899

11. Bäckström, M. G., "Susceptibility of electronic systems to high power microwaves: Summary of test experience," IEEE Transactions on Electromagnetic Compatibility, Vol. 46, No. 3, 2004.

12. Bäckström, M. G., "The threat from intentional EMI against the civil technical infrastructure," Reprint from ESW2006, 16-19, 2006.

13. Taylor, D. and D. V. Giri, High-power Microwave Systems and Effects, Taylor & Francis, 1994.

14. Ali, M. and S. Sanyal, "FDTD analysis of rectangular waveguide in receiving mode as EMI sensors," Progress In Electromagnetics Research B, Vol. 2, 291-303, 2008.
doi:10.2528/PIERB07112901

15. Camp, M., H. Garbe, and D. Nitsch, "Influence of the technology on the destruction effects of semiconductors by impact of EMP and UWB pulses," IEEE Trans. on EMC, Vol. 1, 87-92, 2002.

16. ``JESD78 latch-up testing standard, '' Electronic Industry Association JEDEC standards, "16. JESD78 latch-up testing standard," Electronic Industry Association JEDEC standards.

17. Camp, M., H. Gerth, H. Garbe, and H. Haase, "Predicting the breakdown behavior of microcontrollers under EMP/UWB impact using a statistical analysis," IEEE Trans. on Electromagnetic Compatibility, Vol. 46, 368-379, 2004.
doi:10.1109/TEMC.2004.831816

18. Estreich, D. B., "The physics and modeling of latch-up and CMOS integrated circuits," Stanford Electron. Labs., No. 11, 201-9, 1980.

19. Korte, S., M. Camp, and H. Garbe, "Hardware and software simulation of transient pulse impact on integrated circuits," IEEE Trans. on Electromagnetic Compatibility, Vol. 2, 489-494, 2005.