1. Lei, , G. T., R. W. Techentin, and B. K. Gilbert, "High frequency characterization of power/ground-plane structures," IEEE Trans. on Microwave Theory and Tech., Vol. 47, No. 5, 562-569, May 1999.
doi:10.1109/22.763156
2. Swaminathan, M., D. Chung, S. Grivet-Talocia, K. Bharath, V. Laddha, and J. Xie, "Designing and modeling for power integrity," IEEE Trans. Electromagnetic Compatibility, Vol. 52, No. 2, 288-310, May 2010.
doi:10.1109/TEMC.2010.2045382
3. Huh, S. L., M. Swaminathan, and D. Keezer, "Constant current power transmission line-based power delivery network for single-ended signaling," IEEE Trans. Electromagnetic Compatibility, Vol. 53, No. 4, 1050-1064, Nov. 2011.
doi:10.1109/TEMC.2011.2159980
4. Wu, B. and H. L. Lo, "Methods and designs for improving the signal integrity of vertical interconnects in high performance packaging," Progress In Electromagnetics Research, Vol. 123, 1-11, 2012.
doi:10.2528/PIER11110503
5. Sridharan, V., M. Swaminathan, and T. Bandyopadhyay, "Enhancing signal and power integrity using double sided silicon interposer," IEEE Microwave and Wireless Components Letters, Vol. 21, No. 11, 598-600, Nov. 2011.
doi:10.1109/LMWC.2011.2169239
6. Xu, M., T. H. Hubing, J. Chen, T. P. Van Doren, J. L. Drewniak, and R. E. DuBroff, "Powerbus decoupling with embedded capacitance in printed circuit board design," IEEE Trans. Electromagnetic Compatibility, Vol. 45, No. 1, 22-30, Feb. 2003.
doi:10.1109/TEMC.2002.808075
7. Park, S. G., J. S. Kim, J. G. Yook, and H. K. Park, "Multilayer power delivery network design for reduction of EMI and SSN in high-speed microprocessor system," Journal of the Korea Electromagnetic Eng. Soc., Vol. 2, No. 2, 68-74, Nov. 2002.
8. Wu, T. L., S. T. Chen, J. N. Huang, and Y. H. Lin, "Numerical and experimental investigation of radiation caused by the switching noise on the partitioned dc reference planes of highspeed digital PCB," IEEE Trans. Electromagnetic Compatibility, Vol. 46, No. 1, 33-45, Feb. 2004.
doi:10.1109/TEMC.2004.823680
9. Wu, T. L., Y. H. Lin, T. K. Wang, C. C. Wang, S. T. Chen, and , "Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits," IEEE Trans. on Microwave Theory and Tech., Vol. 53, No. 9, 2935-2942, Sep. 2005.
doi:10.1109/TMTT.2005.854248
10. Oh, S. S., J. M. Kim, and J. G. Yook, "Design of power plane for suppressing spurious resonances in high speed PCBs," Journal of the Korea Electromagnetic Eng. Soc., Vol. 6, No. 1, Mar. 2006.
11. Kim, , D. Y., S. H. Joo, and H. Y. Lee, "A power plane using the hybrid-cell EBG structure for the suppression of GBN/SSN," Journal of The Korea Electromagnetic Eng. Soc., Vol. 18, No. 2, 206-212, Feb. 2007.
doi:10.5515/KJKIEES.2007.18.2.206
12. Eom, D.-S., J. Byun, and H.-Y. Lee, "New composite power plane using spiral ebg and external magnetic material for SSN suppression," Progress In Electromagnetics Research Letters, Vol. 15, 69-77, 2010.
doi:10.2528/PIERL10012104
13. Kwon, J. H., S. I. Kwak, D. U. Sim, and J. G. Yook, "Partial EBG structure with decap for ultra-wideband suppression of simultaneous switching noise in a high-speed system," ETRI J., Vol. 32, No. 2, 265-272, Apr. 2010.
doi:10.4218/etrij.10.1409.0060
14. Kang, H. D., H. Kim, S. G. Kim, and J. G. Yook, "A localized enhanced power plane topology for wideband suppression of simultaneous switching noise," IEEE Trans. Electromagnetic Compatibility, Vol. 52, No. 2, 373-380, May 2010.
doi:10.1109/TEMC.2010.2044415
15. Chung, T. H., H. D. Kang, and J. G. Yook, "Power noise suppression techniques using spiral resonator in high-speed PCB," IEEE Electrical Design of Advanced Packaging and Systems, 2010.
16. Hall, S. H., G. W. Hall, and J. A. McCall, High-speed Digital System Design: A Handbook of Interconnect Theory and Design Practices, John Wiley & Sons, 2000.
17. Hsu, H. M., "Analytical formula for inductance of metal of various widths in spiral inductors," IEEE Trans. on Electron. Devices, Vol. 51, No. 8, 1343-1346, Aug. 2004.
doi:10.1109/TED.2004.832094
18. Koutsoyannopoulos, Y. K. and Y. Papananos, "Systematic analysis and modeling of integrated inductors and transformers in RFIC design," IEEE Trans. Circuits Syst. II, Vol. 47, No. 8, 699-713, Aug. 2000.
doi:10.1109/82.861403
19. Horng, T. S., J. M. Wu, L. Q. Yang, and S. T. Fang, "A novel modified-T equivalent circuit for modeling LTCC embedded inductors with a large bandwidth," IEEE Trans. on Microwave Theory and Tech., Vol. 51, No. 12, 2327-2333, 2003.
doi:10.1109/TMTT.2003.819772
20. Pozar, D. M., Microwave Engineering, 3rd Ed., Wiley-Intersciences, New York, 2005.
21. Kown, J. H., D. U. Sim, S. I. Kwak, and J. G. Yook, "Novel electromagnetic bandgap array structure on power distribution network for suppression simultaneous switching noise and minimizing effects on high-speed signals," IEEE Trans. Electromagnetic Compatibility, Vol. 52, No. 2, 365-372, 2010.
doi:10.1109/TEMC.2010.2045894
22. Yue, C. P. and S. S. Wong, "On-chip spiral inductors with patterned ground shields for Si-based RF ICs," IEEE J. Solid-State Circuits, Vol. 33, No. 5, 743-752, May 1998.
doi:10.1109/4.668989
23. Shi, J., W. Y. Yin, H. Liao, and J. F. Mao, "The enhancement of Q factor for patterned ground shield inductors at high temperatures," IEEE Trans. Mag., Vol. 42, No. 7, 1873-1875, Jul. 2006.
24. Long, J. R. and M. A. Copeland, "The modeling, characterization, and design of monolithic inductors for silicon RF ICs," IEEE J. Solid-State Circuits, Vol. 32, 357-369, Mar. 1997.
doi:10.1109/4.557634
25. Greenhouse, H. M., "Design of planar rectangular microelectronic inductors," IEEE Transactions on Parts, Hybrids and Packaging, Vol. 10, 101-109, Jun. 1974.
doi:10.1109/TPHP.1974.1134841
26. Mohan, S. S., M. Hershenson, S. P. Boyd, and T. H. Lee, "Simple accurate expressions for planar spiral inductances," IEEE J. Solid-State Circuits, Vol. 34, No. 10, 1419-1424, Oct. 1999.
doi:10.1109/4.792620
27. Bahl, I., Lumped Element for RF and Microwaves Circuit, Artech House, Norward, 2003.
28. Johnson, H. and M. Graham, High-speed Digital Design, Prentice Hall, New Jersey, 1993.