1. Abhari, R. and G. V. Eleftheriades, "Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of parallel-plate noise in high-speed circuits," IEEE Trans. Microwave Theory and Techniques, Vol. 51, No. 6, 1629-1639, Jun. 2003.
doi:10.1109/TMTT.2003.812555
2. Sievenpiper, D., L. Zhang, R. F. Jimenez Broas, N. G. Alexopolous, and E. Eli Yablonovitch, "High-impedance electromagnetic surfaces with a forbidden frequency band," IEEE Trans. Microwave Theory and Techniques, Vol. 47, 2059-2073, Nov. 1999.
3. Huh, S. L. and M. Swaminathan, "A design technique for embedded electromagnetic band gap structure in load board applications," IEEE Trans. Electromagnetic Compatibility, Vol. 54, No. 2, 443-456, Apr. 2012.
doi:10.1109/TEMC.2011.2162337
4. De Paulis, F., L. Raimondo, and A. Orlandi, "IR-drop analysis and thermal assessment of planar electromagnetic bandgap structures for power integrity applications," IEEE Trans. Adv. Packaging, Vol. 33, No. 3, 617-622, Aug. 2010.
doi:10.1109/TADVP.2009.2033572
5. Zhu, H.-R., J.-F. Mao, and J.-J. Li, "Signal and power integrity analysis for the novel power plane of EBG structure in high-speed mixed signal systems," IEEE International Wireless Symposium (IWS), 1-4, Apr. 2013.
6. Zhu, H.-R., Y.-F. Sun, Z.-X. Huang, and X.-L. Wu, "A compact EBG structure with etching spiral slots for ultra-wideband simultaneous switching noise mitigation in mixed signal systems," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 9, No. 8, 1559-1567, Aug. 2019.
doi:10.1109/TCPMT.2018.2888512
7. Han, Y., H. A. Huynh, and S. Y. Kim, "Pinwheel meander-perforated plane structure for mitigating power/ground noise in system-in-package," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 8, No. 4, 562-569, Apr. 2018.
doi:10.1109/TCPMT.2018.2798580
8. Wu, T. L., C. C. Wang, Y. H. Lin, T. K. Wang, and G. Chang, "A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits," IEEE Microwave and Wireless Components Letters, Vol. 15, No. 3, 174-176, Mar. 2005.
doi:10.1109/LMWC.2005.844216
9. Kim, K. H. and J. E. Schutt-Ainé, "Analysis and modeling of hybrid planar-type electromagnetic-bandgap structures and feasibility study on power distribution network applications," IEEE Trans. Microwave Theory and Techniques, Vol. 56, No. 1, 178-186, Jan. 2008.
doi:10.1109/TMTT.2007.912199
10. Shi, L.-F., Z.-M. Sun, G.-X. Liu, and S. Chen, "Hybrid-embedded EBG structure for ultrawideband suppression of SSN," IEEE Trans. Electromagnetic Compatibility, Vol. 60, No. 3, 747-753, Jun. 2018.
doi:10.1109/TEMC.2017.2743039
11. Shi, L.-F. and H.-F. Jiang, "Vertical cascaded planar EBG structure for SSN suppression," Progress In Electromagnetics Research, Vol. 142, 423-435, 2013.
doi:10.2528/PIER13080107
12. Shi, L.-F., K.-J. Li, H.-Q. Hu, and S. Chen, "Novel L-EBG embedded structure for the suppression of SSN," IEEE Trans. Electromagnetic Compatibility, Vol. 58, No. 1, 519-520, Feb. 2016.
doi:10.1109/TEMC.2015.2505736
13. De Paulis, F., A. Orlandi, L. Raimondo, and G. Antonini, "Fundamental mechanisms of coupling between planar electromagnetic bandgap structures and interconnects in high-speed digital circuits. Part I --- Microstriplines," Proc. EMC European Workshop, 1-4, Athens, Greece, Jun. 11-12, 2009.
14. Keshwani, V. R., P. P. Bhavarthe, and S. S. Rathod, "Eight shape Electromagnetic Band Gap structure for bandwidth improvement of wearable antenna," Progress In Electromagnetics Research C, Vol. 116, 37-49, 2021.
doi:10.2528/PIERC21070603
15. Chung, D., T. H. Kim, C. Ryu, E. Engin, M. Swaminathan, and J. Kim, "Effect of EBG structures for reducing noise in multi-layer PCBs for digital systems," Proc. IEEE 15th Conf. Electr. Perform. Electron. Packag., 253-256, Oct. 23-25, 2006.
16. Bansode, M. R., R. Dahatonde, and S. S. Rathod, "Simultaneous switching noise reduction in high speed circuits," IEEE International Conference on Communication information and Computing Technology (ICCICT), 1-4, Jun. 25-27, 2021.
17. Kapure, V. R., P. P. Bhavarthe, and S. S. Rathod, "A switchable triple-band notched UWB antenna using compact multi-via electromagnetic band gap structure," Progress In Electromagnetics Research C, Vol. 104, 201-214, 2020.
doi:10.2528/PIERC20052302
18. Shahparnia, S. and O. M. Ramahi, "Miniaturized electromagnetic bandgap structures for broadband switching noise suppression in PCBs," Electron. Lett., Vol. 41, No. 9, 519-520, Apr. 2005.
doi:10.1049/el:20050445
19. Bhavarthe, P. P., S. S. Rathod, and K. T. V. Reddy, "A compact dual band gap electromagnetic band gap structure," IEEE Microwave and Wireless Components Letters, Vol. 67, 596-600, Oct. 2018.
20. Mohajer-Iravaniand, B. and O. M. Ramahi, "Wideband circuit model for planar EBG structures," IEEE Trans. Adv. Packag., Vol. 33, No. 2, 1345-1354, May 2010.
21. Shinde, S., M. Bansode, P. P. Bhavarthe, and S. S. Rathod, "Suppression of SSN in High-Speed Circuits using 1-D EBG structure," International Conference on Computing, Communication and Networking Technologies (ICCCNT), 1-4, Jul. 2020.
22. Kim, T. H., D. Chung, E. Engin, W. Yun, Y. Toyota, and M. Swaminathan, "A novel synthesis method for designing electromagnetic bandgap (EBG) structures in packaged mixed signal systems," Proc. 56th Electron. Compon. Technol. Conf., 1645-1651, 2006.
23. Wu, T. L., C. C. Wang, Y. H. Lin, T. K. Wang, and G. Chang, "A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits," IEEE Microwave and Wireless Components Letters, Vol. 15, No. 3, 174-176, Mar. 2005.
doi:10.1109/LMWC.2005.844216
24. Lu, H. M., J. X. Zha, and Z. Y. Yu, "Design and analysis of a novel electromagnetic bandgap structure for suppressing simultaneous switching noise," Progress In Electromagnetics Research C, Vol. 30, 81-91, 2012.
doi:10.2528/PIERC12042709
25. Ning, C., J. Jin, K. Yang, H. Xie, D. W. Wang, Y. Liao, L. D. Wang, H. S. Chen, E. P. Li, and W.-Y. Yin, "A novel electromagnetic bandgap power plane etched with multiring csrrs for suppressing simultaneous switching noise," IEEE Trans. Electromagnetic Compatibility, Vol. 60, No. 3, 733-737, Jun. 2018.
doi:10.1109/TEMC.2017.2731783
26. Choi, J., V. Govind, and M. Swaminathan, "A novel Electromagnetic Bandgap (EBG) structure for mixed-signal system applications," IEEE Radio and Wireless Conference, 243-246, 2004.
27. De Paulis, F. and A. Orlandi, "Accurate and efficient analysis of planar electromagnetic band-gap structures for power bus noise mitigation in the GHz band," Progress In Electromagnetics Research B, Vol. 37, 59-80, 2012.
doi:10.2528/PIERB11100402
28. High Frequency Structure Simlator, www.ansoft.com, .
29. Kim, K. H. and J. E. Schutt-Aine, "Analysis and modeling of hybrid planar-type electromagnetic-bandgap structures and feasibility study on power distribution network applications," IEEE Trans. Microwave Theory and Techniques, Vol. 56, No. 1, 178-186, Jan. 2008.
doi:10.1109/TMTT.2007.912199
30. Swaminathan, M. and A. Ege Engin, Power Integrity Modeling and Design for Semiconductors and Systems, Prentice Hall, 2008.
31. Wu, T.-L., H.-H. Chuang, and T.-K. Wang, "Overview of power integrity solutions on package and PCB: Decoupling and EBG isolation," IEEE Trans. Electromagnetic Compatibility, Vol. 52, No. 2, 346-356, May 2010.
doi:10.1109/TEMC.2009.2039575
32. Orlandi, A., B. Archambeault, F. de Paulis, and S. Connor, "Impact of planar EBGs on signal integrity in high-speed digital boards," IEEE Trans. Electromagnetic Compatibility, 61-76, 2017.
33. Ning, A. C., J. Jin, K. Yang, H. Xie, D. W. Wang, Y. Liao, L. D. Wang, H. S. Chen, E. P. Li, and W.-Y. Yin, "A novel electromagnetic bandgap power plane etched with multi ring CSRRs for suppressing simultaneous switching noise," Proc. Asia-Pacific Symp. Electromagn. Compat., Singapore, 325-328, 2012.
34. Han, Y., Z. Yan, Y. Wang, and T. Rahman, "A novel EBG structure with embedded meander bridge for broadband suppression of SSN," IEEE Trans. Electromagnetic Compatibility, Vol. 60, No. 3, 325-328, 2012.
35. Mahmood, F. Z., Y. Toyota, K. Iokibe, K. Kondo, and S. Yoshida, "Power/ground layers with EBG structure and ferrite film for noise suppression and power integrity improvement," IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 1-4, 2011.