1. Andrews, J. G, What will 5G be, Vol. 32, No. 6, 1065-1082, IEEE J. Sel. Areas Commun., Jun. 2014.
2. Roh, W., et al. "Millimeter-wave beamforming as an enabling technology for 5G cellular communications: Theoretical feasibility and prototype results," IEEE Commun. Mag., Vol. 52, No. 2, 106-113, Feb. 2014.
doi:10.1109/MCOM.2014.6736750
3. Qu, S., J. Li, Q. Xue, and C. H. Chan, "Wideband cavity-backed bowtie antenna with pattern improvement," IEEE Trans. Antennas Propag., Vol. 56, No. 12, 3850-3854, Dec. 2008.
doi:10.1109/TAP.2008.2007395
4. Qu, S., K. B. Ng, and C. H. Chan, "Waveguide fed broadband millimeter wave short backre antenna," IEEE Trans. Antennas Propag., Vol. 61, No. 4, 1697-1703, Apr. 2013.
doi:10.1109/TAP.2012.2232267
5. Zhang, Y., "Antenna-in-Package technology: Its early development [Historical corner]," IEEE Antennas Propag. Mag., Vol. 61, No. 3, 111-118, Jun. 2019.
doi:10.1109/MAP.2019.2907916
6. Zhang, Y., J. Mao, and , "An overview of the development of antenna-in-package technology for highly integrated wireless devices," Proc. IEEE, Vol. 107, No. 11, 2265-2280, Nov. 2019.
doi:10.1109/JPROC.2019.2933267
7. Park, J., H. Seong, Y. N. Whang, and W. Hong, "Energy-efficient 5G phased arrays incorporating vertically polarized endre planar folded slot antenna for mmWave mobile terminals," IEEE Trans. Antennas Propag., Vol. 68, No. 1, 230-241, Jan. 2020.
doi:10.1109/TAP.2019.2930100
8. Ali, M., et al. "Package-integrated, wideband power dividing networks and antenna arrays for 28-GHz 5G new radio bands," IEEE Trans. Compon. Packag. Manuf. Technol., Vol. 10, No. 9, 1515-1523, Sep. 2020.
doi:10.1109/TCPMT.2020.3013725
9. Park, J., D. Choi, and W. Hong, "Millimeter-wave phased-array Antenna-in-Package (AiP) using stamped metal process for enhanced heat dissipation," IEEE Antennas Wirel. Propag. Lett., Vol. 18, No. 11, 2355-2359, Nov. 2019.
doi:10.1109/LAWP.2019.2938229
10. Liu, D., X. Gu, C. W. Baks, and A. Valdes-Garcia, "Antenna-in-Package design considerations for Ka-band 5G communication applications," IEEE Trans. Antennas Propag.,, Vol. 65, No. 12, 6372-6379, Dec. 2017.
doi:10.1109/TAP.2017.2722873
11. Wang, X., X. Liu, W. Zhang, D. Hao, and Y. Liu, "Surface-mount PIFA using ball grid array packaging for 5G mmWave," Progress In Electromagnetics Research Letters, Vol. 98, 55-60, 2021.
doi:10.2528/PIERL21050203
12. Wang, X., X. Liu, W. Zhang, D. Hao, and Y. Liu, "Surface mounted microstrip antenna using ball grid array packaging for mmWave systems integration," Progress In Electromagnetics Research Letters, Vol. 98, 105-111, 2021.
doi:10.2528/PIERL21051207
13. Lima de Paula, I., et al. "Cost-effective high-performance air-lled SIW antenna array for the global 5G 26 GHz and 28 GHz Bands," IEEE Antennas Wirel. Propag. Lett., Vol. 20, No. 2, 194-198, Feb. 2021.
doi:10.1109/LAWP.2020.3044114