volume | PIER Journals

Abstract

The letter presents a compact, cost-effective, and surface-mount patch antenna element for 5G millimeter-wave (mmWave) system integration. The antenna element adopts ball grid array (BGA) packaging technology to achieve surface mount function, which can be applied to highly integrated systems. By adding a ring slot on the radiating patch, the proposed antenna obtains a wider impedance bandwidth. The antenna prototype has been simulated, manufactured, and verified. The proposed antenna element size is 5 mm × 5 mm × 1.3 mm. The measurement results show that the proposed antenna element can be used in the N257 (26.5 to 29.5 GHz) and N261 (27.5-28.35 GHz) frequency bands.

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Dr. Xiubo Liu

Dr. Wei Zhang

Dr. Dongning Hao

Professor Yanyan Liu