Vol. 87
Latest Volume
All Volumes
PIERB 109 [2024] PIERB 108 [2024] PIERB 107 [2024] PIERB 106 [2024] PIERB 105 [2024] PIERB 104 [2024] PIERB 103 [2023] PIERB 102 [2023] PIERB 101 [2023] PIERB 100 [2023] PIERB 99 [2023] PIERB 98 [2023] PIERB 97 [2022] PIERB 96 [2022] PIERB 95 [2022] PIERB 94 [2021] PIERB 93 [2021] PIERB 92 [2021] PIERB 91 [2021] PIERB 90 [2021] PIERB 89 [2020] PIERB 88 [2020] PIERB 87 [2020] PIERB 86 [2020] PIERB 85 [2019] PIERB 84 [2019] PIERB 83 [2019] PIERB 82 [2018] PIERB 81 [2018] PIERB 80 [2018] PIERB 79 [2017] PIERB 78 [2017] PIERB 77 [2017] PIERB 76 [2017] PIERB 75 [2017] PIERB 74 [2017] PIERB 73 [2017] PIERB 72 [2017] PIERB 71 [2016] PIERB 70 [2016] PIERB 69 [2016] PIERB 68 [2016] PIERB 67 [2016] PIERB 66 [2016] PIERB 65 [2016] PIERB 64 [2015] PIERB 63 [2015] PIERB 62 [2015] PIERB 61 [2014] PIERB 60 [2014] PIERB 59 [2014] PIERB 58 [2014] PIERB 57 [2014] PIERB 56 [2013] PIERB 55 [2013] PIERB 54 [2013] PIERB 53 [2013] PIERB 52 [2013] PIERB 51 [2013] PIERB 50 [2013] PIERB 49 [2013] PIERB 48 [2013] PIERB 47 [2013] PIERB 46 [2013] PIERB 45 [2012] PIERB 44 [2012] PIERB 43 [2012] PIERB 42 [2012] PIERB 41 [2012] PIERB 40 [2012] PIERB 39 [2012] PIERB 38 [2012] PIERB 37 [2012] PIERB 36 [2012] PIERB 35 [2011] PIERB 34 [2011] PIERB 33 [2011] PIERB 32 [2011] PIERB 31 [2011] PIERB 30 [2011] PIERB 29 [2011] PIERB 28 [2011] PIERB 27 [2011] PIERB 26 [2010] PIERB 25 [2010] PIERB 24 [2010] PIERB 23 [2010] PIERB 22 [2010] PIERB 21 [2010] PIERB 20 [2010] PIERB 19 [2010] PIERB 18 [2009] PIERB 17 [2009] PIERB 16 [2009] PIERB 15 [2009] PIERB 14 [2009] PIERB 13 [2009] PIERB 12 [2009] PIERB 11 [2009] PIERB 10 [2008] PIERB 9 [2008] PIERB 8 [2008] PIERB 7 [2008] PIERB 6 [2008] PIERB 5 [2008] PIERB 4 [2008] PIERB 3 [2008] PIERB 2 [2008] PIERB 1 [2008]
2020-08-18
Sensitivity Analysis of Microstrip Tree S-Parameters by Using Tensorial Analysis of Networks
By
Progress In Electromagnetics Research B, Vol. 87, 193-209, 2020
Abstract
This paper introduces a tensorial analysis of networks (TAN) applied to a tree asymmetrical structure. To illustrate the TAN concept easily, the present investigation is applied to a three-port structure represented by a Y-tree topology. The unfamiliar method of TAN circuit modelling is elaborated from the graph topology. The fast formulation of the Y-matrix model of the structure is established from branch and mesh space TAN analyses. The TAN model is validated with commercial tool simulation and measurements from DC up to 0.5 GHz in the frequency domain and two different waveform signals in the time domain. The proof of concept circuit is implemented in microstrip technology on an FR4-epoxy dielectric substrate. Mapping sensitivity analysis with respect to the Y-tree RLC-parameters is realized by showing that local variations around initial set of R, L, and C do not equally influence reflection and transmission coefficients over the frequency bandwidth. If a similar impact is observed at the lowest frequency, maximum variations up to 250% show the importance of parameters ranking to improve both microstrip design and modelling.
Citation
Lucius Ramifidisoa, Rivo Randriatsiferana, Sebastien Lallechere, Zhifei Xu, and Blaise Ravelo, "Sensitivity Analysis of Microstrip Tree S-Parameters by Using Tensorial Analysis of Networks," Progress In Electromagnetics Research B, Vol. 87, 193-209, 2020.
doi:10.2528/PIERB20041405
References

1. Hoefer, W. J. R., "The transmission-line matrix method --- Theory and applications," IEEE Trans. MTT, Vol. 33, No. 10, 882-893, Oct. 1985.
doi:10.1109/TMTT.1985.1133146

2. Ney, M., "Method of moments as applied to electromagnetic problems," IEEE Trans. MTT, Vol. 33, No. 10, 972-980, Oct. 1985.
doi:10.1109/TMTT.1985.1133158

3. Jin, J., The Finite Element Method in Electromagnetics, John Wiley & Sons, New York, USA, 1993.

4. Rizzoli, V., A. Costanzo, F. Mastri, and A. Neri, "A general SPICE model for arbitrary linear dispersive multiport components described by frequency-domain data," Proc. 2003 IEEE MTT-S Int. Microwave Symp. Digest, Vol. 1, 9-12, Philadelphia, PA, USA, Jun. 8-13, 2003.

5. Krishna, K. S. R., J. L. Narayana, and L. P. Reddy, "ANN models for microstrip line synthesis and analysis," Int. J. Elect. Syst. Sci. Eng., Vol. 1, 196-200, 2008.

6., https://www.3ds.com/products-services/simulia/products/cst-studio-suite/, accessed 2019.

7., https://www.ansys.com/products/electronics/ansys-hfss, accessed 2019.

8., https://altairhyperworks.com/product/FEKO/Applications-Antenna-Design, accessed 2019.

9., https://www.keysight.com/us/en/assets/7018-02343/brochures/5990-4819.pdf, accessed 2019.

10., EM/EMC Simulation Software, https://www.emcos.com/?product-types=em-simulation-software, accessed 2019.

11. Schuster, C. and W. Fichtner, "Parasitic modes on printed circuit boards and their effects on EMC and signal integrity," IEEE Trans. EMC, Vol. 43, No. 4, 416-425, Nov. 2001.

12. Archambeault, R., C. Brench, and S. Connor, "Review of printed-circuit-board level EMI/EMC issues and tools," IEEE Trans. EMC, Vol. 52, No. 2, 455-461, May 2010.

13. Kim, J. and E. Li, "Special issue on PCB level signal integrity, power integrity, and EMC," IEEE Trans. EMC, Vol. 52, No. 2, 246-247, May 2010.

14. Ruehli, A. E. and A. C. Cangellaris, "Progress in the methodologies for the electrical modeling of interconnects and electronic packages," Proceedings of the IEEE, Vol. 89, No. 5, 740-771, 2001.

15. Ruan, A., J. Yang, L. Wan, B. Jie, and Z. Tian, "Insight into a generic interconnect resource model for Xilinx Virtex and Spartan series FPGAs," IEEE Trans. CAS-II: Express Briefs, Vol. 60, No. 11, 801-805, Nov. 2013.

16. Buckwalter, J. F., "Predicting microwave digital signal integrity," IEEE Trans. Advanced Packaging, Vol. 32, No. 2, 280-289, May 2009.

17. Jun, F., X. Ye, J. Kim, B. Archambeault, and A. Orlandi, "Signal integrity design for high-speed digital circuits: Progress and directions," IEEE Trans. EMC, Vol. 52, No. 2, 392-400, May 2010.

18. Ruehli, A. E. and A. C. Cangellaris, "Progress in the methodologies for the electrical modeling of interconnects and electronic packages," Proc. of the IEEE, Vol. 89, No. 5, 740-771, 2001.

19. Charlet, F. and J. F. Carpentier, "Extraction of 3D interconnect impedances using edge elements without gauge condition," Proc. Int. Conf. on Simulation of Semiconductor Processes and Device, 143-146, Kobe, Japan, Sep. 4-6, 2002.

20. Chen, M., D. Shi, Y. Li, L. Zhu, and H. Liu, "Research on branches group based method for adding mutual inductance branches to Y -matrix and Z-matrix," Proc. 2014 IEEE PES General Meeting Conference & Exposition, 1-5, National Harbor, MD, USA, Jul. 27-31, 2014.

21. Wojnowski, M., M. Engl, and R. Weigel, "Considerations on impedance matrix determination for accurate passive device characterization," Proc. 2007 IEEE Workshop SPI, 117-120, Genova, Italy, May 13-16, 2007.

22. Tu, C., J. Bao, Y. Du, and W. Wu, "An improved design method for asymmetric RF MEMS tunable filter utilizing admittance matrix," Proc. 2010 IEEE Int. Conf. on Microwave and Millimeter Wave Technology, 1766-1769, Chengdu, China, May 8-11, 2010.

23. Chiariello, A. G., A. Girardi, C. Iorio, R. Izzi, T. Lessio, A. Maffucci, and S. Ventre, "Efficient evaluation of the frequency-dependent impedance matrix of full-package structures," Proc. 2010 IEEE 14th Workshop on SPI, 127-130, Hildesheim, Germany, May 9-12, 2010.

24. Ymeri, H., B. Nauwelaers, K. Maex, D. De Roest, S. Vandenberghe, and M. Stucchi, "Admittance matrix calculations of on-chip interconnects on lossy silicon substrate using multilayer Green’s function," Proc. 2001 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems. Digest of Papers (IEEE Cat. No. 01EX49 , 50-59, Ann Arbor, MI, USA, Sep. 14, 2001.

25. Sun, Y.-Y., "Immittance matrices of multiconductor transmission lines," Journal of the Franklin Institute, Vol. 307, No. 1, 59-67, Jan. 1979.

26. Xu, J. and Y.-H. Lv, "System-level construction of multiconductor transmission line inductance matrix," Proc. 2009 3rd IEEE Int. Symp. on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 903-906, Beijing, China, Oct. 27-29, 2009.

27. Hou, R. and C. Taibin, "Y parameter matrix and calculation method built for multi-port network based on graph theory," Proc. 2011 IEEE 3rd International Conference on Communication Software and Networks, 621-623, Xi’an, China, May 27-29, 2011.

28. Ravelo, B., "Behavioral model of symmetrical multi-level T-tree interconnects," Progress In Electromagnetics Research B, Vol. 41, 23-50, 2012.

29. Kron, G., Tensor Analysis of Networks, Wiley, New York; Chapman & Hall, London, 1939.

30. Maurice, O., A. Reineix, P. Hoffmann, B. Pecqueux, and P. Pouliguen, "A formalism to compute the electromagnetic compatibility of complex networks," Advances in Applied Science Research, Vol. 2, No. 5, 439-448, 2011.

31. Maurice, O., Elements of Theory for Electromagnetic Compatibility and Systems, Bookelis, Aix en Provence, France, 2017.

32. Ravelo, B. and O. Maurice, "Kron-Branin modeling of Y-Y-tree interconnects for the PCB signal integrity analysis," IEEE Trans. on Electromagnetic Compatibility, Vol. 59, No. 2, 411-419, Apr. 2017.

33. Cholachue, C., B. Ravelo, A. Simoens, and A. Fathallah, "Fast S-parameter TAN model of N-port lumped structures," IEEE Access, Vol. 7, No. 1, 72505-72517, Dec. 2019.

34. Xu, Z., Y. Liu, B. Ravelo, and O. Maurice, "Modified Kron’s TAN modeling of 3D multilayer PCB," Proc. of 11th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2017, 242-247, St. Petersburg, Russia, Jul. 4-8, 2017.

35. Xu, Z., J. Fan, and O. Maurice, "Sensitivity analysis of PCB interconnect and package with TAN formalism," Proc. of 2019 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo), 81-83, Hangzhou, China, 2019.

36. Xu, Z., Y. Liu, B. Ravelo, and O. Maurice, "Multilayer power delivery network modeling with modified Kron’s method (MKM)," Proc. of 16th Int. Symposium on Electromagnetic Compatibility (EMC) Europe 2017, 1-6, Angers, France, Sep. 4-8, 2017.

37. Xu, Z., Y. Liu, B. Ravelo, J. Gantet, N. Marier, and O. Maurice, "Direct time-domain TAN model of 3D multilayer hybrid PCB: Experimental validation," IEEE Access, Vol. 6, No. 1, 60645-60654, Dec. 2018.

38. Gupta, K. C., R. Garg, and I. Bahl, Microstrip Lines and Slotlines, Artech, Dedham, MA, 1979.

39. Hammerstad, E. and O. Jensen, "Accurate models for microstrip computer aided design," Proc. 1980 IEEE MTT-S Int. Microwave Symp. Digest, 407-409, Washington, DC, USA, May 28-30 1980.

40. Frickey, D. A., "onversions between S, Z, Y, h, ABCD, and T parameters which are valid for complex source and load impedances," IEEE Trans. on MTT, Vol. 42, No. 2, 205-211, Feb. 1994.

41. Saltelli, A., S. Tarantola, F. Campolongo, and M. Ratto, Sensitivity Analysis in Practice: A Guide to Assessing Scientific Models, John Wiley & Sons, 2004.