volume | PIER Journals

Abstract

An analytic model of the field-to-line coupling in time domain for electrically small lines using a transverse electromagnetic (TEM) cell is proposed in this paper. This model uses mutual capacitance and mutual inductance to represent electric and magnetic field couplings which can be obtained based on voltage and current dividers. The measurement and calculation results validate the accuracy of the model. The termination effect on electromagnetic interference (EMI) responses and the separation of electric and magnetic field couplings are investigated by the model. The results indicate relevant suppressions for radiated immunity. This model is convenient for fast radiated immunity estimations.

1. Lagos, J. L. and F. L. Fiori, "Worst-case induced disturbances in digital and analog interchip interconnects by an external electromagnetic plane wave-Part I: Modeling and algorithm," IEEE Trans. on Electromagnetic Compatibility, Vol. 53, No. 1, 178-184, 2011.
doi:10.1109/TEMC.2010.2085005

2. Magdowski, M. and R. Vick, "Closed-form formulas for the stochastic electromagnetic field coupling to a transmission line with arbitrary loads," IEEE Trans. on Electromagnetic Compatibility, Vol. 54, No. 5, 1147-1152, 2012.
doi:10.1109/TEMC.2012.2193130

3. Land, S. O., M. Ramdani, R. Perdriau, et al. "Using a modified Taylor cell to validate simulation and measurement of field-to-shorted-trace coupling," IEEE Trans. on Electromagnetic Compatibility, Vol. 56, No. 4, 864-870, 2014.
doi:10.1109/TEMC.2014.2313231

4. Land, S. O., T. Mandic, M. Ramdani, et al. "Comparison of field-to-line coupling models: Coupled transmission lines model versus single-cell corrected Taylor model," Proc. Int. Symp. on Electromagnetic Compatibility (EMC Europe), 276-281, 2013.

5. Mandic, T., B. Pejcinovic, and A. Baric, "Comparison of simulation and measurement of time-timedomain," Proc. Int. Symp. on Electromagnetic Compatibility (EMC Europe), 681-685, 2014.

6. Kasturi, V., S. Deng, T. Hubing, et al. "Quantifying electric and magnetic field coupling from integrated circuits with TEM cell measurements," Proc. IEEE Int. Symp. Electromagnetic Compatibility, Vol. 2, 422-425, 2006.

7. Deng, S., T. Hubing, and D. Beetner, "Characterizing the electric field coupling from IC heatsink structures to external cables using TEM cell measurements," IEEE Trans. on Electromagnetic Compatibility, Vol. 49, No. 4, 785-791, 2007.
doi:10.1109/TEMC.2007.908825

8. Deng, S., T. Hubing, and D. Beetner, "Using TEM cell measurements to estimate the maximum radiation from PCBs with cables due to magnetic field coupling," IEEE Trans. on Electromagnetic Compatibility, Vol. 50, No. 2, 419-423, 2008.
doi:10.1109/TEMC.2008.919026

9. Shi, C., W. Fang, C. Chai, et al. "Using termination effect to characterize electric and magnetic field coupling between TEM cell and microstrip line," IEEE Trans. on Electromagnetic Compatibility, Vol. 57, No. 6, 1338-1344, 2015.
doi:10.1109/TEMC.2015.2459063

10. "Integrated circuits, measurement of electromagnetic emissions Part 2: Measurement of radiated emissions, TEM cell and wideband TEM cell method," IEC 61967-2, 1st Edition, 2005.

11. "Integrated circuits, measurement of electromagnetic immunity Part 2: Measurement of radiated immunity, TEM cell and wideband TEM cell method," IEC 62132-2, 1st Edition, 2010.

12. Ludwig, R. and G. Bogdanov, RF Circuit Design Theory and Applications, 2nd Ed., Publishing House of Electronics Industry, 2010.

Dr. Chunlei Shi

Dr. Changchun Chai

Dr. Yintang Yang

Dr. Wenxiao Fang