volume | PIER Journals

2013-11-09

EMC Computer Modelling and Simulation of Integrated Circuits in QFN Package

Haiyan Sun,

Dr. Haiyan Sun

Nantong University

China

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Boyuan Zhu,

Dr. Boyuan Zhu

Sch Engn

Griffith Univ

Australia

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Ling Sun,

Dr. Ling Sun

Nantong University

China

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Hengxu Li,

Dr. Hengxu Li

School of Engineering

Griffith University

Australia

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Lingling Yang

Dr. Lingling Yang

Nantong University

China

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Progress In Electromagnetics Research M, Vol. 33, 263-275, 2013

doi:10.2528/PIERM13082802

Abstract

This paper discusses the application of computational electromagnetics (CEM) for electromagnetic compatibility (EMC) problems of integrated circuits (ICs). It is known that the application of CEM is versatile in solving a wide range of problems. This paper focuses on the electromagnetic study of quad flat non-lead (QFN) packaged ICs, one monolithic microwave integrated circuit (MMIC) and another radio frequency integrated circuit (RFIC), from the individual chip to system in package (SiP). Full-wave electromagnetic technique is conducted in the modelling and simulation. Both chips are found producing radiated emissions in horizontal directions as omnidirectional antennas at working frequencies and then directional at resonance frequencies.

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Haiyan Sun, Boyuan Zhu, Ling Sun, Hengxu Li, and Lingling Yang, "EMC Computer Modelling and Simulation of Integrated Circuits in QFN Package," Progress In Electromagnetics Research M, Vol. 33, 263-275, 2013.
doi:10.2528/PIERM13082802

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