1. Wong, , S. W. and L. Zhu, "Ultra-wideband power divider with good in-band splitting and isolation performances," IEEE Microw. Wireless Components Lett., Vol. 18, No. 8, 518-520, Aug. 2008.
doi:10.1109/LMWC.2008.2001009
2. Chiu, L. and Q. Xue, "A parallel-strip ring power divider with high isolation and arbitrary power-dividing ratio," IEEE Trans. Microw. Theory Tech., Vol. 55, No. 11, 2419-2426, Nov. 2007.
doi:10.1109/TMTT.2007.908669
3. Wong, , K. W., L. Chiu, and Q. Xue, "Uniplanar power dividers using asymmetric coplanar striplines and slotlines," Proc. 38th European Microw. Conf., 337-340, Amsterdam, The Netherlands, Oct. 2008.
4. Yang, N., C. Caloz, and K. Wu, "Wideband phase-reversal antenna using a novel bandwidth enhancement technique," IEEE Trans. Antennas Propagation, Vol. 58, No. 9, 2823-2830, Sep. 2010.
doi:10.1109/TAP.2010.2052550
5. Chang, C.-Y., C.-W. Tang, and D.-C. Niu, "Ultra-broad-band doubly balanced star mixers using planar Mouw's hybrid junction," IEEE Trans. Microw. Theory Tech., Vol. 49, No. 6, 1077-1085, Jun. 2001.
doi:10.1109/22.925494
6. Hirota, , T., Y. Tarusawa, and H. Ogawa, "Uniplanar MMIC hybrids --- A proposed new MMIC structure," IEEE Trans. Microw. Theory Tech., Vol. 56, No. 6, 576-581, Jun. 1987.
doi:10.1109/TMTT.1987.1133706
7. Simons, R. N., Coplanar Waveguide Circuits, Components and Systems, Vol. 6, 163-165, John Wiley & Sons, Inc., 1997.
8. Basu, S. and L. Hayden, "An SOLR calibration for accurate measurement of orthogonal on-wafer DUTs," IEEE MTT-S Digest, 1335-1338, Denver, CO, USA, Jun. 1997.
9. Sun, , Y. and A. P. Freundorfer, "Broadband folded Wilkinson power combiner/splitter," IEEE Microw. Wireless Components Lett., Vol. 14, No. 6, 295-297, Jun. 2004.
doi:10.1109/LMWC.2003.821491
10. Kim, K., J. Byun, and H.-Y. Lee, "Substrate integraged waveguide Wilkinson power divider with improved isolation performance," Progress In Electromagnetics Research Letters, Vol. 19, 41-48, 2010.
11. Lan, X., P. Chang-Chien, F. Fong, D. Eaves, X. Zeng, and M. Kintis, "Ultra-wideband power divider using multi-wafer packaging technology," IEEE Microw. Wireless Components Lett., Vol. 21, No. 1, 46-48, Jan. 2011.
doi:10.1109/LMWC.2010.2091262