1. Kamgaing, T. and O. M. Ramahi, "A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface," IEEE Microw. Wireless Compon. Lett., Vol. 13, No. 1, 21-23, Jan. 2003.
doi:10.1109/LMWC.2002.807713
2. Abhari, R. and G. V. Eleftheriades, "Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high speed circuits," IEEE Trans. Microw. Theory Tech., Vol. 51, No. 6, 1629-1639, Jun. 2003.
doi:10.1109/TMTT.2003.812555
3. Ricchiuti, V., "Power-supply decoupling on fully populated highspeed digital PCBs," IEEE Trans. Electromagn. Compat., Vol. 43, No. 4, 671-676, Nov. 2001.
doi:10.1109/15.974649
4. Xu, M., T. H. Hubing, J. Chen, T. P. Van Doren, J. L. Drewniak, and R. E. DuBroff, "Power-bus decoupling with embedded capacitance in printed circuit board design," IEEE Trans. Electromagn. Compat., Vol. 45, No. 1, 22-30, Feb. 2003.
doi:10.1109/TEMC.2002.808075
5. Wu, T. L., C. C. Wang, Y. H. Lin, T. K. Wang, and G. Chang, "A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures," IEEE Microw. Wireless Compon. Lett., Vol. 14, No. 7, 337-339, Jul. 2004.
6. Wu, T. L., C. C. Wang, Y. H. Lin, T. K. Wang, and G. Chang, "A novel power plane with super wideband elimination of ground bounce noise on high speed circuits," IEEE Microw. Wireless Compon. Lett., Vol. 15, No. 3, 174-176, Mar. 2005.
doi:10.1109/LMWC.2005.844216
7. Kim, D.-Y., S.-H. Joo, and H.-Y. Lee, "A hybrid-cell EBG power plane for ultra-wideband suppression of ground bounce noise," Microwave & Opt. Tech. Lett., Vol. 49, No. 11, Nov. 2007.
8. Joo, S.-H., D.-Y. Kim, and H.-Y. Lee, "A S-bridged inductive electromagnetic bandgap power plane for suppression of ground bounce noise," IEEE Microw. Wireless Compon. Lett., Vol. 17, No. 10, 709-711, Oct. 2007.
doi:10.1109/LMWC.2007.905604
9. Kim, Y., F. Yang, and A. Z. Elsherbeni, "Compact artificial magnetic conductor designs using planar square spiral geometries," Progress In Electromagnetics Research, Vol. 77, 43-54, 2007.
doi:10.2528/PIER07072302
10. Eom, D-.S., D.-Y. Kim, J. Byun, and H.-Y. Lee, "Composite EBG power plane using magnetic materials for SSN suppression in high-speed digital circuits," The Journal of Korea Electromagnetic Engineering Society, Vol. 19, No. 8, 933-939, Aug. 2008.
doi:10.5515/KJKIEES.2008.19.8.933
11. Toyota, Y., K. Iokibe, R. Koga, A. E. Engin, T. H. Kim, and M. Swaminathan, "Miniaturization of electromagnetic bandgap structures with high-permeability magnetic metal sheet," IEEE International Symposium on Electromagnetic Compatibility, Jul. 2007.