Institute of Microelectronics, Advanced Optoelectronic Technology Center
National Cheng-Kung University
Taiwan
Homepage
Institute of Microelectronics, Department of Electrical
National Cheng-Kung University
Taiwan
Homepage
Department of Electronic and Computer Engineering
National Taiwan University of Science and Technology
Taiwan
Homepage
Institute of Computer and Communication Engineering
National Taipei University of Technology
Taiwan
Homepage1. Chen, R. L., C. Ji, T. H. Hubing, and S. Weimin, "Analytical model for the rectangular power-ground structure including radiation loss ," IEEE Transactions on Electromagnetic Compatibility, Vol. 47, No. 1, 10-16, 2005.
doi:10.1109/TEMC.2004.842204
2. Chen, J., T. H. Hubing, T. P. V. Doren, and R. E. DuBroff, "Power bus isolation using power islands in printed circuit boards," IEEE Transactions on Electromagnetic Compatibility, Vol. 44, No. 2, 373-380, 2002.
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4. Wu, T. L., S. T. Chen, J. N. Hwang, and Y. H. Lin, "Numerical andexp erimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speedd igital PCB," IEEE Transactions on Electromagnetic Compatibility, Vol. 46, No. 1, 33-45, 2004.
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5. Chang, C. S., D. B. Lin, K. C. Hung, I. T. Tang, and M. P. Houng, "Simultaneous switching noise mitigation capability with low parasitic effect using aperiodic high-impedance surface structure," Progress In Electromagnetics Research Letters, Vol. 4, 149-158, 2008.
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8. Das, S., A. Chakrabarty, and A. Chakraborty, "Characteristics of an offset longitudinal/transverse slot coupled crossed waveguide junction using multiple cavity modeling technique considering the TE00 mode at the slot aperture," Progress In Electromagnetics Research, Vol. 67, 297-316, 2007.
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9. Lee, J., Y. M. Seng, M. K. Iyer, and J. Kim, "Investigation of plane-to-plane noise coupling through cutout in multi-layer power-ground planes," IEEE Electronics Packaging Technology Conference, 257-260, 2002.
10. Leone, M., "The radiation of a rectangular power-bus structure at multiple cavity-mode resonances," IEEE Transactions on Electromagnetic Compatibility, Vol. 45, 486-492, 2003.
doi:10.1109/TEMC.2003.815560
11. Wu, C. T., G. H. Shiue, S. M. Lin, and R. B. Wu, "Composite effects of reflections and ground bounce for signal line through a split power plane ," IEEE Transactions on Advanced Packaging, Vol. 25, No. 2, 297-301, 2002.
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12. Antonini, G., A. C. Scogna, A. Orlandi, and V. Ricchiuti, "Cross-SSN analysis in multilayer printed circuit boards," IEEE International Symposium on Electromagnetic Compatibility, Vol. 3, 705-710, 2005.
13. Lee, J., M. D. Rotaru, M. K. Iyer, H. Kim, and J. Kim, "Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs," IEEE Transactions on Advanced Packaging, Vol. 28, 298-309, 2005.
doi:10.1109/TADVP.2005.846932
