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Special Issue: Multiphysics (Electro-thermal-mechanical) Modeling for Advanced Electronic Devices and Integrated Circuits

Editors: Wenchao Chen Qing Huo Liu
2021-01-01

Special Issue Information

This Special Issue aims to invite researchers to contribute original research papers, dealing with all aspects of Multiphysics modeling/computation in advanced devices and integrated circuits. Topics of interest include, but are not limited to:

Multiphysics modeling for optoelectronic devices, RF active and passive devices
Multiphysics modeling for advanced semiconductor devices
Multiphysics modeling for emerging materials based electronic devices
Multiphysics modeling for RF circuits/systems, 3D integrated circuits

Special Issue Editors:

Wenchao Chen

Zhejiang University
China

Qing Huo Liu

Duke University
USA

Manuscipts Submission:

Manuscripts should be submitted online. This special issue title should be selected during the online submission process. All papers will be peer-reviewed. Accepted papers will be published online continuously (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers).