Special Issue 6: Multiphysics (Electro-thermal-mechanical) Modeling for Advanced Electronic Devices and Integrated Circuits
Editors: Wenchao Chen and Qing Huo Liu

2020-12-14

◈ Special Issue Information:


This Special Issue aims to invite researchers to contribute original research papers, dealing with all aspects of Multiphysics modeling/computation in advanced devices and integrated circuits. Topics of interest include, but are not limited to:

  • Multiphysics modeling for optoelectronic devices, RF active and passive devices
  • Multiphysics modeling for advanced semiconductor devices
  • Multiphysics modeling for emerging materials based electronic devices
  • Multiphysics modeling for RF circuits/systems, 3D integrated circuits


Special Issue Editors:

Wenchao Chen
Professor
Zhejiang University/University of Illinois at Urbana-Champaign Institute
Zhejiang University, China
Qing Huo Liu
Professor
Duke University, USA

 

Manuscipts Submission:

Manuscripts should be submitted online. This special issue title should be selected during the online submission process. All papers will be peer-reviewed. Accepted papers will be published online continuously (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers).

 

Published Papers in This Special Issue:

2020-08-22
Computational Investigation of Nanoscale Semiconductor Devices and Optoelectronic Devices from the Electromagnetics and Quantum Perspectives by the Finite Difference Time Domain Method (Invited Review)

By Huali Duan, Wenxiao Fang, Wen-Yan Yin, Erping Li, and Wenchao Chen
Progress In Electromagnetics Research, Vol. 170, 63-78, 2021
doi:10.2528/PIER20122201

More papers to be added here ...