Special Issue 6: Multiphysics (Electro-thermal-mechanical) Modeling for Advanced Electronic Devices and Integrated Circuits Editors: Wenchao Chen and Qing Huo Liu
◈ Special Issue Information：
This Special Issue aims to invite researchers to contribute original research papers, dealing with all aspects of Multiphysics modeling/computation in advanced devices and integrated circuits. Topics of interest include, but are not limited to:
◈ Special Issue Editors：
Zhejiang University/University of Illinois at Urbana-Champaign Institute
Zhejiang University, China
|Qing Huo Liu
Duke University, USA
◈ Manuscipts Submission:
Manuscripts should be submitted online. This special issue title should be selected during the online submission process. All papers will be peer-reviewed. Accepted papers will be published online continuously (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers).
◈ Published Papers in This Special Issue:
Computational Investigation of Nanoscale Semiconductor Devices and Optoelectronic Devices from the Electromagnetics and Quantum Perspectives by the Finite Difference Time Domain Method (Invited Review)
By Huali Duan, Wenxiao Fang, Wen-Yan Yin, Erping Li, and Wenchao Chen
Progress In Electromagnetics Research, Vol. 170, 63-78, 2021
More papers to be added here ...