Vol. 95

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2020-12-09

A New Equivalent Circuit Scheme for Grounded Back-to-Back GCPW-MS-GCPW Transitions Fabricated on a Thin Low-k Substrate

By Pierre-Vincent Dugue, Mohammed El-Gibari, Mathieu Halbwax, Stephane Ginestar, Vanessa Avramovic, Jean-Pierre Vilcot, and Hongwu Li
Progress In Electromagnetics Research Letters, Vol. 95, 33-42, 2021
doi:10.2528/PIERL20093003

Abstract

We hereby present a new equivalent circuit model including both lumped and distributed elements for GCPW-MS transitions (GCPW for Grounded Coplanar Waveguide and MS for Microstrip). In order validating the modelling results, such transitions have been fabricated on a 20 µm-thick BCB (Benzocyclobutene resin) substrate using grounding pads including via-holes of different diameters. The study focuses on the impact of the via-hole design on the performance of the transition and more specifically on its bandwidth. The transitions were made using a simple technological process based on photosensitive polymer. ADS simulation data of the new equivalent circuit model were in very good agreement with measured S-parameters. Both theoretical and experimental results show that the bandwidth of such a transition can reach up to 100 GHz bandwidth using via-holes of 900 µm diameter.

Citation


Pierre-Vincent Dugue, Mohammed El-Gibari, Mathieu Halbwax, Stephane Ginestar, Vanessa Avramovic, Jean-Pierre Vilcot, and Hongwu Li, "A New Equivalent Circuit Scheme for Grounded Back-to-Back GCPW-MS-GCPW Transitions Fabricated on a Thin Low-k Substrate," Progress In Electromagnetics Research Letters, Vol. 95, 33-42, 2021.
doi:10.2528/PIERL20093003
http://jpier.org/PIERL/pier.php?paper=20093003

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