Vol. 15

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2010-08-14

A Novel Signal Integrity Methodology by 3D Direct Analysis for Microwave Testing Probes

By Sung-Mao Wu and Sheng-Wei Guan
Progress In Electromagnetics Research C, Vol. 15, 187-199, 2010
doi:10.2528/PIERC10060702

Abstract

This research uses innovative approaches for characterizing spring probes, a final-test bottleneck applied to microwave packaging. The modeling method depends on conventional microwave on-wafer measurement. This paper compares the novel microwave 3D direct calibration and measurement to observe the issues of spring probe reliability. We makes the key component of a novel approach to 3D calibration and measurement, the double-sided thru calibration element with delay time delivers from 3D EM simulation. The current study compares the modeling method and 3D direct measurement to prove the capability of the latter and presents the reliability about compressing distance of spring probes.

Citation


Sung-Mao Wu and Sheng-Wei Guan, "A Novel Signal Integrity Methodology by 3D Direct Analysis for Microwave Testing Probes," Progress In Electromagnetics Research C, Vol. 15, 187-199, 2010.
doi:10.2528/PIERC10060702
http://jpier.org/PIERC/pier.php?paper=10060702

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