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2013-09-24

Novel Non-Direct Contacting Measurement Using Signal Transfer Model Extraction and Vertical Coupling Theorem

By Sung-Mao Wu, Wen De Chien, and Ren-Fang Hsu
Progress In Electromagnetics Research B, Vol. 55, 45-62, 2013
doi:10.2528/PIERB13041706

Abstract

Traditional contacting measurement has numerous disadvantages, including high cost, high damage rate, low mobility, etc. In this study, to resolve these serious problems, a simiple, broadband non-contacting loop has been disigned to transmit and receive a signal. An equivalent dual-port non-contacting measurement model and a theorem of vertical coupling capacitance and inductance have been proposed. From the results of the dual-port model simulation and the fabricated sample measurement, a theorem of singal reconstruction and novel non-contacting measurement presented.

Citation


Sung-Mao Wu, Wen De Chien, and Ren-Fang Hsu, "Novel Non-Direct Contacting Measurement Using Signal Transfer Model Extraction and Vertical Coupling Theorem," Progress In Electromagnetics Research B, Vol. 55, 45-62, 2013.
doi:10.2528/PIERB13041706
http://jpier.org/PIERB/pier.php?paper=13041706

References


    1. Smith, K., P. Hanaway, M. Jolley, R. Gleason, E. Strid, T. Daenen, L. Dupas, B. Knuts, E. J. Marinissen, and M. Van Dievel, "\Evaluation of TSV and micro-bump probing for wide I/O testing," 2011 IEEE International Test Conference (ITC), 1-10, 2011.
    doi:10.1109/TEST.2011.6139180

    2. Soejima, K., M. Kimura, Y. Shimada, and S. Aoyama, "New probe microstructure for full-wafer, contact-probe cards," 1999 Proceedings: 49th Electronic Components and Technology Conference, 1175-1180, 1999.

    3. Huang, J.-T., K.-Y. Lee, C.-S. Wu, C.-Y. Lin, and S.-H. Shih, "Using micro-electroforming and micro-assembly technology to fabricate vertical probe card," International Conference on Electronic Materials and Packaging, 2006. EMAP 2006, 1-5, 2006.

    4. Tsao, Y.-C., J.-J. Tang, and Y.-L. Hsieh, "Analysis of probing effects on solder bump," Proceedings of 6th Electronics Packaging Technology Conference, 2004. EPTC 2004, 303-307, 2004.

    5. Kumar, S., S. Rao, T. K. Guan, and F. Harun, "Influence of wafer probing against initial bonding," 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 1-8, 2010.
    doi:10.1109/IEMT.2010.5746671

    6. Kim, J. Y., H. J. Lee, H. J. Choi, S. J. Lee, and S. W. Moon, "Design, fabrication and mechanical characterization of vertical micro contact probe," 5th IEEE Conference on Sensors, 1155-1158, 2006.

    7. Zapatka, M. and R. Ziser, "An introduction to coaxial RF probing solutions for mass-production tests," 74th ARFTG Microwave Measurement Symposium, 2009, 1-6, 2009.
    doi:10.1109/ARFTG74.2009.5439097

    8. Andes, J. and E. Bogatin, "The socket response to current pack-aging and test trends," IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium, 97-99, 2004.
    doi:10.1109/IEMT.2004.1321639

    9. Hung, S.-K., C.-F. Tsai, Y.-P. Hsu, D.-J. Tzou, M.-H. Lin, and L.-C. Fu, "Automatic probe alignment for atomic force microscope," IEEE International Conference on Mechatronics, 2005. ICM'05,, 909-912, 2005.
    doi:10.1109/ICMECH.2005.1529383

    10. Lin, S.-Y., S.-K. Yen, W.-S. Chen, and P.-H. Cheng, "Printed magnetic field probe with enhanced performances," Asia Pacific Microwave Conference, 2009., 649-652, 2009.
    doi:10.1109/APMC.2009.5384134

    11. Kim, J.-M., W.-T. Kim, and J.-G. Yook, "Resonance-suppresse magnetic field probe for EM field-mapping system," IEEE Transactions on Microwave Theory and Techniques, Vol. 53, No. 9, 2693-2699, 2005.
    doi:10.1109/TMTT.2005.854203

    12. Funato, H. and T. Suga, "Magnetic near-field probe for GHz band and spatial resolution improvement technique," 17th International Zurich Symposium on Electromagnetic Compatibility, 2006. EMC-Zurich 2006, 284-287, 2006.
    doi:10.1109/EMCZUR.2006.214926

    13. Ren, Z., M. S. Boybay, and O. M. Ramahi, "Near-field probes for subsurface detection using split-ring resonators," IEEE Transactions on Microwave Theory and Techniques, Vol. 59, No. 2, 488-495, 2011.
    doi:10.1109/TMTT.2010.2094201

    14. Boybay, M. S. and O. M. Ramahi, "Experimental and numerical study of sensitivity improvement in near-field probes using single-negative media," IEEE Transactions on Microwave Theory and Techniques, Vol. 57, No. 12, 3427-3433, 2009.
    doi:10.1109/TMTT.2009.2033863

    15. Masuda, N., N. Tamaki, T. Kuriyama, J. C. Bu, M. Yamaguchi and K. Arai, "High frequency magnetic near field measurement on LSI chip using planar multi-layer shielded loop coil," IEEE International Symposium on Electromagnetic Compatibility, Vol. 1, 80-85, 2003.

    16. Sujintanarat, P., P. Dangkham, S. Chaichana, K. Aunchaleevara-pan, and P. Teekaput, "Analysis of electromagnetic emission from PCB by using a near-field probe," International Symposium on Communications and Information Technologies, 2006. ISCIT'06, 208-211, 2006.
    doi:10.1109/ISCIT.2006.340032

    17. Ren, Z., M. S. Boybay, and O. M. Ramahi, "Near-field subsurface detection in lossy media using single split resonator probe," IEEE MTT-S International Microwave Workshop on Wireless Sensing Local Positioning, and RFID, 2009. IMWS 2009,, 1-3, 2009.

    18. Shi, J., R. E. DuBroff, K. Slattery, M. Yamaguchi, and K.-I. Aral, "A study of the probe induced disturbances on the near-fid measurement," 2003 IEEE International Symposium on Electromagnetic Compatibility, 2003. EMC'03, Vol. 1, 127-130, 2003.

    19. Boyer, A., S. Bendhia, and E. Sicard, "Characterisation of electromagnetic susceptibility of integrated circuits using near-field scan," Electronics Letters, Vol. 43, No. 1, 15-16, 2007.
    doi:10.1049/el:20073130

    20. Huang, C.-H. , R.-F. Hsu, S.-M. Wu, Y.-C. Tang, and C.-C. Chen, "Radiation modeling and performance reconstructing of signal connection in package substrate using non-contacting probe," Asia-Paci¯c Microwave Conference Proceedings (APMC), 1035-1038, 2011.

    21. Al-Nuaimi, M. K. T., "Compact CPW-fed antenna loaded with dumbbell slot defected ground structure," Loughborough Antennas and Propagation Conference (LAPC), Vol. 1--4, No. 14--15, 2011.

    22. Saladi, A. S. R., J. R. Panda, and R. S. Kshetrimayum, "An E-shaped CPW-fed folded-slot antenna for the 2.45 GHz RFID applications," 2011 International Conference on Communications 2011 International Conference on Communications , 363-366, 2011.

    23. Jung, D., C.-H. Ahn, and K. Chang, "Ultra wideband CPW fed modified ring antenna," IEEE Antennas and Propagation Society International Symposium, 1-4, 2009.

    24. Hettak, K., G. Y. Delisle, G. A. Morin, S. Toutain, and M. Stubbs, "A novel variant 60-GHz CPW-fed patch antenna for broadband short range wireless communications," IEEE Antennas and Propagation Society International Symposium, 2008. AP-S 2008, 1-4, 2008.
    doi:10.1109/APS.2008.4619753

    25. Kalhor, H. A., "Comparison of Ampere's circuital law (ACL) andthe law of Biot-Savart (LBS)," IEEE Transactions on Education, Vol. 31, No. 3, 236-238, 1988.
    doi:10.1109/13.2322

    27. Balanis, C. A., Antenna Theory: Analysis and Design, Wiley, Hoboken, NJ, 2005.

    28. Howard Johnson and Martin Graham, High Speed Digital Design: A Handbook of Black Magic, Prentice Hall, 1993.